surfacer 发表于 2012-8-24 16:23
再来看看美国佬的招人要求:
Experience in mechanical design/ packaging to meet temperature, shock,vi ...
Location: | UNITED STATES.CALIFORNIA.SAN JOSE |
Job Title: | Server Mechanical Design Lead |
Area of Interest: | Engineering - Hardware |
Job Description: | Mechanical Design Technical Leader Opportunity Snapshot: In this role you will be part of team designing the next generation of UCS C-series rack servers. We are looking for candidates who strive in a fast paced start-up like environment. You will be part of a dedicated team, open communications, empowerment, innovation, teamwork and customer success are the foundations of the team. Thus, you set your own limits for learning and achievements. We are looking for a self driven individual who can lead cross functional teams and work closely with a wide variety of internal & external engineering partners to enable them to leverage our products for their needs. Job Requirements: ? Drive requirements and specifications for chassis design of Cisco’s UCS C-series rack servers. ? Strong designer of chassis and mechanical sub-assemblies, with 10+ years experience. ? Understanding of thermal design, acoustics, power efficiency, and finite element analysis. ? Design for high volume tooling and DFM for assembly. ? Provide guidance to other teams on trade offs on costs. ? Work with third-party vendor engineering teams, and drive ODM vendors. Technical Background ? Candidate must have first hand experience in the design or implementation of multiple chassis for the modern datacenter. ? Expert user and knowledge of ProE ? Familiarity with the latest cooling techniques and heatsink design ? Hands on experience with Intel processor based platforms Experience leading small technical teams to complete complicated mechanical assemblies for mass-production |
Job Description: | Conceptualize, plan and execute the design and development of 1U switch packaging products. Consults with cross-functional units for product requirements, definitions and design. Defines, directs and participates in the design verification and testing of new products. ? Direct electronics industry experience, well skilled in the art and science of electronics packaging at the board, box and rack level. ? Proficiency in developing conceptual and production designs using Siemens’s NX 3-D solids modeling software, version 10. 4000hr plus of recent experience. Other MCAD application experience considered. ? Has experience in the design and development of tooling for high volume sheet metal, plastic and die casting. ? Expertise in designing high volume, cost effective products that meet worldwide customer, regulatory and compliance requirements. ? Thermal management and structural design expertise. Proficiency using Flotherm for CFD thermal simulations would be a plus. ? Responsibilities include initiating informal reviews of ideas and technical objectives within and across business units. ? Successful Candidate is expected to perform with little management direction ? Exceptional written and verbal communication skills ? Grace under pressure and a positive attitude are mandatory. ? History of successful collaboration with project teams required ? Demonstrates ability to successfully influence win-win cross-functional dynamics. Resolves conflicts by fostering team communications. ? Enjoys working in a fast paced and often multi-project environment. Educational Background Recommended Typically requires BSME or equivalent training with 7-10+ yrs related exp. Preferred: MSME or equivalent |
Job Description: | Conceptualize, plan and execute the design and development of network switch products with emphasis in thermal management. Direct electronics industry experience, well skilled in the art and science of electronics packaging at the board, box and rack level, Must be knowledgeable with all modes heat transfer in electronics (convection, conduction and radiation) and should be able to balance the design to use each mode effectively, efficiently and to the best cost advantage. Good thermal modeling skills are expected and successful candidate should be adept at laboratory methods as well. Proficiency using Flotherm for CFD thermal simulations is required. Consults with cross-functional units for product requirements, definitions and design. Defines, directs and participates in the design verification and testing of new products. -Help define thermal design of Cisco’s products that meets or exceeds the requirements while balancing multiple changing and conflicting requirements. -Develops multiple platforms concurrently. --Collaborate on investigations of new thermal technologies and materials. -Interfaces directly with partner companies in prototype development. - Takes direction and input from product design architects and tech leads in design and implementation of the best thermal solution for the product. -Define, guide and complete statistical data reduction of thermal lab experiments to characterize thermal materials, cooling components, and cooling systems. -Performs extensive Thermal modeling and testing, correlates results, and provides simple and concise summaries to management and non-thermal engineering peers. -Communication of status/results via presentations to thermal/product design team. -Actively participate in cross-functional team design reviews and technology investigations. -Manages work and test done by technicians and lower level engineers. -Expertise in designing for high volume, cost effective products that meet worldwide customer, regulatory and compliance requirements. -Initiates informal reviews of ideas and technical objectives within and across business units. -Proficiency in structural analysis desired -Some expertise in a 3D solids based MCAD system desired. -Experienced in thermal and airflow testing -Excellent communication skills -Experienced in Networking/Computer product development -Experienced with blower and fan design -Experienced with both forced and natural convection, conduction and radiation heat transfer techniques -Experience with manufacturing, thermal parts/components supply chains and cross-communications between design, ODM and third party vendor teams Successful Candidate is expected to perform with little management direction. Demonstrates ability to successfully influence win-win cross-functional dynamics. Resolves conflicts by fostering team communications. Enjoys working in a fast paced and often multi-project environment. Exercises considerable latitude in determining technical objectives of assignment. Completed work is reviewed by management through consultation from a relatively long time perspective, for results. Translates BU level goals in to own work assignments. Interfaces cross-functionally and leads team collaboration extending beyond work group. Requires excellent verbal skills and professional presentation. Sponsors and models exemplary team interaction. Encourages and accepts personal feedback. Mentors junior team members. Demonstrate ability to successfully influence win-win cross-functional dynamics. Resolves conflicts by fostering team communications. Provides technical guidance to small teams. Takes ownership for initiatives and drives on-going evaluation and success. Determines own methods on issue resolution. Uses judgment to solve problems where protocol might not exist. Applies high degree of ingenuity using broad parameters for foundation of decisions. Solve Problems & Make Decisions. Demonstrate Leadership. Establishes Plans. Thinks Globally. Dedication to Customer Success. Innovation and Learning. Educational Background Recommended Typically requires BSME or equivalent training with 7-10+ yrs related exp. Preferred: MSME or equivalent. |
Job Description: | Responsibilities: 1.Plan and execute the design and development of system packaging for internetworking products. 2.Defines, participates in the design verification and testing of new products. 3.Leads the resolution of field and product problems. 4.Selects electro-mechanical components such as air movers, heatsinks and complex interconnection systems and supports the evaluation and selection of new suppliers. 5.Provides vendors with improvement recommendations. 6.Responsible for the design and documentation of computer enclosures and related electro-mechanical assemblies using solids modeling techniques. 7.Performs system level structural and thermal analysis and analysis data is in-depth. Involve the determination of form factors, raw materials, and manufacturing processes. 8.Consults with internal cross-functional units for definition and design of product requirements. Be able to take the leadership in the design and development of a sub system in a high complex engineering projects. 9.Involve in developing technical content of the system specification/unit function specification. Identifies issues and technical interdependencies and suggests possible changes. Requirements: 1.Fluency in spoken and written English. Expertise in designing to meet worldwide compliance requirements. 2.Technical expertise in 3D solids based MCAD system and desire for maximum productivity. Proficiency in Thermal Analysis tools (Flotherm, Icepak, etc.) and/or structural analysis SW tools (Ansys, Pro Mechanical etc) desirable. 3.Able to perform complex stress, beam and thermal calculations to guide designs. 4.Proficient in geometric tolerance and tolerance analysis. 5.Able to generate test plans, conduct tests and generate test reports for Thermal and MDVT. Understanding of Safety Agency design criteria and EMC design techniques for modules and enclosures. 6.Works independently, initiates reviews of ideas with stake holders. Interfaces cross-functionally and participates in cross-functional consultation with Customer Services, Mfg, Mktg and HW Engineering. 8.Customer resolution requires excellent verbal skills and professional presentation. Education: BSME with 5-7 years, or MSME with 5+ years, Global work experience with US companies preferred. |
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